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EIRC Director

Steven A. Boggs, Director of EIRC and Research Professor of Physics, Electrical Engineering, and Materials Science

E-Mail: sboggs@mail.ims.uconn.edu

Education

  • MBA, University of Toronto, 1987
  • Ph.D., University of Toronto, 1972
  • M.Sc., University of Toronto, 1969
  • B.A., Reed College, Portland, Oregon, 1968

Positions Held

  • Director, Engineering and Research, Underground Systems, Inc., 1987-1993
  • Vice-President, Chicago Condenser Corporation, 1987-1992
  • Ontario Hydro Research, various positions, January 1975-February, 1987
  • Research Engineer, Electronic Associates, March 1974 to December, 1974
  • PDF, Canada Center for Remote Sensing, September 1973 to March 1974

Experience

During his 12 years with the Research Division of Ontario Hydro, Steve conducted research in the areas of solid dielectrics, thermal cable design, and SF6-insulated systems. He was project leader of the team which developed the EPRI Thermal Property Analyzer (TPA), the first instrument to be licensed by EPRI. In the area of SF6-insulated systems, he pioneered the study of fast transients, and statistical modeling of disconnector operation. Much of this work was carried out in cooperation with the major manufacturers including Alsthom, ASEA, Brown-Boveri, and Siemens all of which were subcontractors under his direction during an EPRI-sponsored project to improve the reliability of solid dielectric spacers for GIS. Steve was elected a Fellow of the IEEE for his contributions to GIS technology.  He also worked extensively in the area of partial discharge detection and solid dielectrics.  He made some of the first ultrawideband measurements of PD pulses and did the base work on the theory of ultrawideband PD detection, propagation of PD pulses in shielded cables, etc.  At Underground Systems, Inc., Steve conceived and patented the room temperature HTSC cable design under EPRI sponsorship which was developed by Pirelli and American Superconductor.  As part of this work, he published the first measurements of AC conduction losses in high temperature superconducting conductors.  He also invented a new cable termination design which has been fully qualified.  At the University of Connecticut, Steve has concentrated on high field phenomena in solid dielectrics, and development and applications of programs for transient nonlinear finite element analysis.  As seen from the selected publications below, he has continued some work in the area of SF6 insulated systems, outdoor insulation, etc.

Steve is author of over 100 technical publications and is a Contributing Editor to Electrical Insulation Magazine. Steve has consulted for the ITAIPU Hydro Electric Project in Brazil, FURNAS (Rio de Janeiro), numerous US utilities, Union Carbide (DOW), EXXON, Toshiba Corporation of Japan, ABB, The Okonite Company, etc.

Selected Publications

Partial Discharge

ZnO Arresters

Transient Nonlinear Finite Element Analysis and Applications Thereof

Transient Phenomena in Power Systems

Solid Dielectric Cables

DC Cables

Nonlinear Dielectrics

Measurement Instrumentation

SF6-Insulated Systems

High Field Phenomena in Dielectrics

Capacitor Technology

Outdoor Insulation Systems

High Temperature Superconductivity

Soil Thermal Properties

  • Boggs, S.A., F.Y. Chu, H.S. Radhakrishna, and J.E. Steinmanis, eds.  Underground Cable Thermal Backfill.  Pergamon Press, 1982.
  • Boggs, S.A., F.Y. Chu, H.S. Radhakrishna, and J.E. Steinmanis.  “Measurements of Soil Thermal Properties - Techniques and Instrumentation”.  IEEE Trans PAS-99, No. 2, 1980.  p. 747-752.
  • Radhakrishna, H., F.Y. Chu, and S.A. Boggs.  “Improved Thermal Design of Underground Transmission Systems - The Importance of Thermal Stability”.  Transmission & Distribution, January, 1980.
  • Boggs, S.A., F.Y. Chu, and J.D.A. Griffin.  “Improved Thermal Design of Underground Transmission Systems - Instrumentation and Measurement Techniques”.  Transmission & Distribution, February, 1980.
  • Radhakrishna, H.S., F.Y. Chu, and S.A. Boggs.  “Thermal Stability and its Prediction in Cable Backfill Soils”.  IEEE Trans PAS-99, No. 3, 1980.  p. 865.