Surface Analysis

A wide array of instrumentation is available to enable elemental and chemical analysis of surfaces and near-surface regions. In addition, depth profiling, elemental image mapping, and micro-area analysis extend the capabilities of many of these techniques. Elemental and chemical analysis is achieved through the use of Auger Electron Spectroscopy, Secondary Ion Mass Spectroscopy, and X-ray Photoelectron Spectroscopy.

Phi Multiprobe System

The Multiprobe includes a 595 Scanning Auger Electron Spectrometer, a Secondary Electron Detector for imaging, a quadrupole Secondary Ion Mass Spectrometer with oxygen injection, a doublepass non-scanning Auger Electron Spectrometer, a twin anode X-ray Photoelectron Spectrometer, and two Argon Ion Sputter Guns all within one ultra-high vacuum system.

Phi Model 590 Scanning Auger Electron Spectrometer

with Argon Ion Sputter Gun for depth profiling

VG X-ray Photoelectron Spectrometer

This system includes a liquid nitrogen cooled fracture stage, heating/gas reaction chamber, two twin anodes and one monochromatic X-ray sources, electron charge neutralization, and two duo-plasmatron ion sputter guns.

Zygo 3-D Optical Scanning Interferometer Profilometer

The Zygo white light interferometric profilometer offers fast, non-contact, high accuracy, 3D metrology of surface features for a wide variety of samples. The software provides graphic images and high-resolution numberical analysis to characterize the surface structure of materials at magnifications up to 2000X. Maximum vertical range is 20mm with a resolution of 0.1nm. At the lowest magnification (80X) the field of view is 1.7 x 1.3 mm with 1.22 micron lateral resolution (0.67 micron resolution at higher mags) and stitching capabilities allow for mapping of extensive areas. The Zygo system includes an isiolation table for high-magnification work and will fit samples up to 4 inches high and 7 inches square. Samples must be somewhat reflective, though materials may be sputter coated with a minimal amount of gold (~100 angstroms) to assist in imaging without substantially changing the topography. Analysis capabilities include histograms, various filters, and masks. Algorithms provide leveling for sample images and can separate Roughness values from overall topography such as cylinders of spheres.