Morphology Rearrangement of Block Copolymer under Various External Condition: A Computer Simulation Approach Friday, December 7, 2007 11:00 am , IMS Room 20 Morphology Rearrangement of Block Copolymer under Various External Condition: A Computer Simulation Approach Won Ho Jo Department of Materials Science and Engineering, and Hyperstructured Organic Materials Research Center, Seoul National University, Seoul 151-742, Korea Tel: +82-2-880-7192, Fax: +82-2-874-9576, e-mail: whjopoly@snu.ac.kr During the last decade, nanosized structures have attracted considerable interest due to the continuing demands for miniaturization of devices and electronic components. Block copolymers offer a fascinating means to develop ordered structures in nanoscale through self-organization, on the basis of chain connectivity and interaction between momomer constituents. These nanosized, self-organized structures can be affected not only by constitutional and thermodynamic conditions such as composition and temperature but also by various type of external condition such as shear flow, electric field, and confinement. Recently, some experiments have shown that shear can induce the global orientation and the remedy of topological defects in ordered structures formed by block copolymers. Such alignment and defect-remedial process is of crucial importance in fabricating electronic and photonic devices. This talk presents some simulation works on structure development of polymeric materials under various external conditions In the first part of talk, the effects of shear and electric fields on block copolymer systems are presented, particularly focusing on the mechanism for the global orientation and defect remedy of the ordered structures. The second part is concerned with the morphological modulation developed on nano-patterned surfaces. To investigate how these external conditions affect the block copolymer morphology in a systematic way, a cell dynamics simulation was employed.
This seminar is sponsored by a generous grant from U.S. Surgical Corporation |