University of Connecticut University of UC Title Fallback Connecticut

UConn-FEI Center for Advanced Microscopy and Materials Analysis, A Tech Park Strategic Partnership

Key Components

  • 7 new state-of-the art instruments
  • Facility Staff Scientist
  • Half-time Field Service Engineer
  • Research funding ($400k/year – 5 year min.)
  • Graduate scholarships ($50k/year – 5 year min.)
  • Training of staff
  • Engagement contributions

 


Phase 1 Instruments

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TalosF200XTalos F200X

  • FEG TEM/STEM
  • Super-X SDD EDXS
  • HAADF STEM
  • 16M Ceta Camera
  • Enclosure stability
  • Velox workflow

 

 

 

HeliosPFIBHelios PFIB

  • Xe plasma ion column
  • M/C electron column
  • Charge neutralizer
  • EasyLift TEM prep
  • Auto Slice-and-View
  • SDD EDS & EBSD*

 

 

 

 

TeneoLoVacTeneoLoVac

  • FEG-SEM
  • 3 In-lens detectors
  • Segmented DBS
  • Annular ESEM GAD
  • SDD EDS*
  • EBSD*

 

 

 

 

Aspex-ExplorerAspex Explorer

  • Thermionic SEM
  • Automated imaging and EDS analysis
  • SED and BSED
  • Integrated SDD EDS
  • Chamber IR camera

 

 

 

 

Helios-Nanolab460F1Helios Nanolab 460F1

  • Ga ion column
  • M/C electron column
  • Charge neutralizer
  • Multi-Chem (Pt,W,C)
  • Auto Slice-and-View
  • SDD EDS & EBSD*

 

 

 


Phase 2 Instruments

To be Located in New Innovation Partnership Building (IPB) of the Tech Park

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Titan-ThemisTitan Themis

  • 300kV TEM/STEM
  • Probe CS corrected
  • Super-X SDD EDXS
  • Quantum EELS/GIF
  • HAADF STEM
  • 16M Ceta Camera

 

 

 

Verios460LVerios 460L

  • M/C FEG-SEM
  • Beam deceleration
  • 3 In-lens detectors
  • Segmented DBS
  • SDD EDS*
  • EBSD*